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The “Material Handling Unit” developed by us is a versatile, flexible placement machine, which places test specimens from a tray into the base of an STS tester. Subsequently, different temperatures can be induced into the socket by means of a thermostreamer.
The gantry axes, driven by a servo motor, are controlled by a programmable logic controller. A Cognex camera performs various checks to place the test specimen exactly at the target location. This ease of operation is a great relief for the user. The test specimen is picked up by a vacuum suction device on the head module. This module is an interchangeable unit, which means that different types of bases can be used.
The exchange unit is adjustable to all DUTs, so the handling is suitable for microchips, substrates, packages etc.
Our placement system (MHU) is currently mainly used by our customers in the field of semiconductor wafer handling systems.
The MHU placement system combines mechanical accuracy with highest quality. The easy-to-use and flexible programming software enables highest flexibility at high productivity. Fast setup times and minimal maintenance contribute significantly to lowering the total cost of ownership and ensure a fast return on investment.
For individual testing of electronic components, we have designed our Material Handling Unit MIC (MHU-MIC) as a pick-and-place machine for small production lines and prototyping.
The unique features of our MHU-MIC include the pick-up of large components even from undefined trays. The intelligent head-vision system makes it possible to find these components, pick them up, align them with the vacuum suction cup and place them precisely.
The entire usable area can be loaded with printed circuit boards or with semi-standard trays.
For the sensitive wafers (silicon wafers) we have developed our MHU-WAFER. A complex wafer handling system, which plays a crucial role in semiconductor manufacturing. It is designed to facilitate the handling of silicon wafers during the semiconductor manufacturing process.
This requires a finely tuned interaction between camera systems, robotic elements and state-of-the-art drive technology coupled with a great deal of technical knowledge.
The difficulty in automating wafer systems is that silicon wafers come in different sizes and shapes. Flexible adaptation to your current requirements is a matter of course for us.
We find solutions for complex wafer handling application or integration of automation into your existing process tool Our proven experience and deep understanding of wafer handling automation and fab integration requirements enable us to design wafer handling equipment to meet all your project requirements.
We design and build reliable, industry-proven wafer handling systems for some of the world’s leading semiconductor manufacturers around the globe.
compact Design (space saving)
flexible gripper (customer-specific to the respective test specimen adaptable)
user-friendly
Tray/ End deposit of test specimens versatile programmable (Differentiation of Test results "IO" "NIO")
24-hour continuous testing possible without personnel deployment
Our placement systems can be flexibly adapted to the customer's needs.
In the electronics industry, pick-and-place systems are used to place objects automatically. They are particularly suitable for applications where precise and efficient handling of products is required.
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We are experts for innovative automation solutions, plant engineering and construction. In the field of standard plant engineering and special machine engineering, our services include the development, production and integration of machines and plants.
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